Title of article
Molecular modeling for calculation of mechanical properties of epoxies with moisture ingress
Author/Authors
Clancy، نويسنده , , T.C. and Frankland، نويسنده , , S.J.V. and Hinkley، نويسنده , , J.A. and Gates، نويسنده , , T.S.، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2009
Pages
7
From page
2736
To page
2742
Abstract
Atomistic models of epoxy structures were built in order to assess the effect of crosslink degree, moisture content and temperature on the calculated properties of a typical representative generic epoxy. Each atomistic model had approximately 7000 atoms and was contained within a periodic boundary condition cell with edge lengths of about 4 nm. Four atomistic models were built with a range of crosslink degree and moisture content. Each of these structures was simulated at three temperatures: 300 K, 350 K, and 400 K. Elastic constants were calculated for these structures by monitoring the stress tensor as a function of applied strain deformations to the periodic boundary conditions. The mechanical properties showed reasonably consistent behavior with respect to these parameters. The moduli decreased with decreasing crosslink degree and with increasing temperature. The moduli generally decreased with increasing moisture content, although this effect was not as consistent as that seen for temperature and crosslink degree.
Keywords
Epoxy , SIMULATION , mechanical properties
Journal title
Polymer
Serial Year
2009
Journal title
Polymer
Record number
1732937
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