• Title of article

    Molecular modeling for calculation of mechanical properties of epoxies with moisture ingress

  • Author/Authors

    Clancy، نويسنده , , T.C. and Frankland، نويسنده , , S.J.V. and Hinkley، نويسنده , , J.A. and Gates، نويسنده , , T.S.، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2009
  • Pages
    7
  • From page
    2736
  • To page
    2742
  • Abstract
    Atomistic models of epoxy structures were built in order to assess the effect of crosslink degree, moisture content and temperature on the calculated properties of a typical representative generic epoxy. Each atomistic model had approximately 7000 atoms and was contained within a periodic boundary condition cell with edge lengths of about 4 nm. Four atomistic models were built with a range of crosslink degree and moisture content. Each of these structures was simulated at three temperatures: 300 K, 350 K, and 400 K. Elastic constants were calculated for these structures by monitoring the stress tensor as a function of applied strain deformations to the periodic boundary conditions. The mechanical properties showed reasonably consistent behavior with respect to these parameters. The moduli decreased with decreasing crosslink degree and with increasing temperature. The moduli generally decreased with increasing moisture content, although this effect was not as consistent as that seen for temperature and crosslink degree.
  • Keywords
    Epoxy , SIMULATION , mechanical properties
  • Journal title
    Polymer
  • Serial Year
    2009
  • Journal title
    Polymer
  • Record number

    1732937