Title of article
Heat melding of voided polyethylene microstructures
Author/Authors
Medina، نويسنده , , D.I. and Chinesta، نويسنده , , F. and Mackley، نويسنده , , M.R.، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2009
Pages
9
From page
3302
To page
3310
Abstract
This paper is concerned with the fabrication of voided polyethylene microstructures by heat melding of plastic microcapillary films (MCFs) to form microcapillary monoliths (MCMs), which are consolidated layers of MCFs forming in two-dimensional arrays of microcapillaries. MCMs were manufactured by heat melding multiple layers of low-voidage MCFs or high-voidage MCFs. The optimal conditions for interface adhesion of the MCFs to create MCMs without compromising capillary integrity were investigated.
Fs were processed from linear low-density polyethylene (LLDPE) and the melt rheology of the polymer was studied to provide rheological parameters that could be used both to gain an understanding of the character of the polymer and for modeling of the MCM forming process. In particular, the temperature dependent nature of the rheology was investigated at the transition from viscous-dominated behavior to elastic-dominated behavior. Modeling of the melding process provided some additional information and confirmed issues in relation to the thermal bonding temperatures and mechanisms.
Keywords
MCFs , MCMs , Heat melding , Microcapillary films , Microcapillary monoliths
Journal title
Polymer
Serial Year
2009
Journal title
Polymer
Record number
1733010
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