Title of article
Ion-assisted deposition of copper using an inverter plasma
Author/Authors
Kiuchi، نويسنده , , Masato and Murai، نويسنده , , Kensuke and Tanaka، نويسنده , , Katsutoshi and Takechi، نويسنده , , Seiji and Sugimoto، نويسنده , , Satoshi and Goto، نويسنده , , Seiichi، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
3
From page
273
To page
275
Abstract
Adhesive Cu deposition using an inverter plasma was studied. Using an inverter power supply to produce a pulse plasma, it is possible to apply high voltage in one direction and low voltage in the other, and to perform deposition by a process of sputtering alternating with ion assistance. We deposited Cu film by setting the Cu target in front of the substrate using Si wafer and glass. Deposited films were examined by a peel-off test using Scotch tape. They exhibited excellent adhesion.
Keywords
Inverter , Copper , Pulse plasma , Ion-assisted deposition
Journal title
Surface and Coatings Technology
Serial Year
2001
Journal title
Surface and Coatings Technology
Record number
1800742
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