Title of article
A study on the synthesis and formation behavior of nanostructured TiN films by copper doping
Author/Authors
Myung، نويسنده , , Hyun S. and Han، نويسنده , , Jeon G. and Boo، نويسنده , , Jin H.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2004
Pages
5
From page
404
To page
408
Abstract
Ti–Cu–N nanocomposite films with varying copper content were deposited by simultaneous co-deposition of titanium nitride and copper using a reactive arc ion plating and magnetron sputtering hybrid system. The structure and mechanical properties of these films were found to be dependent on the copper concentration. A maximum hardness of 42 GPa was exhibited by Ti–Cu–N film containing 1.5 at.% Cu. The role of a soft metallic phase in Ti–Cu–N nanostructured films containing one hard and one soft phase is also discussed.
Keywords
Ti–Cu–N , Copper doping , Superhard coating , Nanostructured coating
Journal title
Surface and Coatings Technology
Serial Year
2004
Journal title
Surface and Coatings Technology
Record number
1807176
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