Development of a novel cathodic plasma/electrolytic deposition technique: Part 2: Physico-chemical analysis of the plasma discharge

A novel plasma system has been developed recently for the deposition of carbon and titanium thin films on metal and metal alloy substrates. Unlike other deposition techniques, the process occurs in liquid precursors and a plasma discharge is created and confined around the cathode in a superheated vapour sheath surrounded by the liquid phase. This paper presents a detailed analysis of the physico-chemical mechanisms underlying this process. A correlation has then been carried out between the voltage/current characteristics and the consecutive physical phenomena occurring during the process (vapour phase formation, plasma discharge initiation and evolution). The structure and composition of the produced TiO2 films have been compared with the composition and physical characteristics of the plasma discharge. This analysis allowed the construction of a first dissociation and deposition mechanism for this new plasma system.