Catalytically enhanced H2-free CVD of transition metals using commercially available precursors

The deposition of metals using thermal CVD in a hydrogen-free atmosphere was investigated starting from nontoxic metalorganic precursors. A remarkably simple process, which relies on the chemical reduction by alcohols, allows the deposition of high-quality films of a variety of metals and alloys. The growth characteristics of metal films are investigated as a function of temperature, and their performance is discussed in terms of electrical resistivity. Near-bulk resistivities were obtained for Ni, Co, Cu, and Ag, while Fe presents a 37-fold higher resistivity than the bulk because of the poor packing of crystallites. In this work, the deposition conditions for the growth of single-phase cubic or hexagonal nickel were determined.