• Title of article

    Thermal behaviour of CpCuPEt3 in gas phase and Cu thin films processing

  • Author/Authors

    Senocq، نويسنده , , F. and Turgambaeva، نويسنده , , A. and Prud’homme، نويسنده , , N. and Patil، نويسنده , , U. and Krisyuk، نويسنده , , V.V. and Samélor، نويسنده , , D. and Gleizes، نويسنده , , A. and Vahlas، نويسنده , , C.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2007
  • Pages
    4
  • From page
    9131
  • To page
    9134
  • Abstract
    Decomposition of CpCuPEt3 (Cp = >>>(η5-C5H5)) and MOCVD of Cu films from CpCuPEt3 have been investigated in the frame of an ongoing project on the processing of Cu-containing coatings. The behaviour of CpCuPEt3 vapours under heating conditions was studied by in situ mass spectrometry. It was established that this compound is monomeric in gas phase. Its decomposition mechanism on hot surface was proposed. From mass spectroscopy experiments, it was established that decomposition in vacuum begins at 150 °C with evolution of PEt3. Beyond 270 °C, formation of cyclopentadiene is observed, indicating that a change in decomposition mechanism occurs. The saturating vapour pressure of CpCuPEt3 was estimated through static method, in order to optimize transport conditions and to control the molar fraction of the precursor in the gas phase. Finally, growth rate and microstructure of MOCVD processed Cu films from CpCuPEt3 have been investigated.
  • Keywords
    Copper films , Clapeyron law , Vapour pressure , mass spectrometry
  • Journal title
    Surface and Coatings Technology
  • Serial Year
    2007
  • Journal title
    Surface and Coatings Technology
  • Record number

    1817338