Semi-analytical model for thin film deformation analysis

Modelling of thermal deformation and the corresponding stress distribution are significant for the thin-film design. In order to evaluate the mechanical properties experienced by a thin film parameter on the rigid substrate, the author proposes a semi-analytical model to estimate the deformation of the thin film under various conditions. The physical interpretation and simplification of each term is obtained through the order-of-magnitude analysis. Analytical forms for the thin film deformation can be obtained, and the stress in the film can be easily determined using the proposed model through the constitutive law.