Title of article
Ultrasonic soldering in electronics
Author/Authors
Lanin، نويسنده , , V.L.، نويسنده ,
Pages
7
From page
379
To page
385
Abstract
Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows the use of lead-free solders. Methods of US solder melt activation, lead-free solders in US soldering and glass–ceramic capacitor metallization processes have been investigated.
Keywords
soldering , Electronic components , ultrasonic
Journal title
Astroparticle Physics
Record number
2005600
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