X-ray residual stress analysis on machined and tempered HPSN-ceramics

The residual stress state induced by grinding and tempering of hot pressed silicon nitride (HPSN) samples is studied by X-ray diffraction. The results reveal that the residual stress values at the surface of the samples as well as their gradient within the penetration depth of the X-rays depend on the sintering aid and thus, on the glassy phase content of the HPSN. Tempering of the ground HPSN reduces the residual stress values due to microplastic deformation, whereas an oxidation of the glassy phase leads to the formation of compressive residual stresses.