• Title of article

    Cytocompatible biointerface on poly(lactic acid) by enrichment with phosphorylcholine groups for cell engineering

  • Author/Authors

    Watanabe، نويسنده , , Junji and Nederberg، نويسنده , , Fredrik and Atthoff، نويسنده , , Bjِrn and Bowden، نويسنده , , Tim and Hilborn، نويسنده , , Jِns and Ishihara، نويسنده , , Kazuhiko، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2007
  • Pages
    5
  • From page
    227
  • To page
    231
  • Abstract
    A tunable biointerface was designed and prepared using a novel biocompatible phospholipid polymer composed of 2-methacryloyloxyethyl phosphorylcholine (MPC), n-butyl methacrylate, and isomeric poly(lactic acid) macromonomer. The phospholipid polymer was coated on a substrate, and the surface characterization was examined in terms of surface elemental analysis by X-ray photoelectron spectroscopy and dynamic contact angle measurements. The phosphorylcholine (PC) group in the MPC units was enriched after immersion in a buffer solution following heating above its glass transition temperature. After the enrichment of the phosphorylcholine group, the surface wettability was significantly improved and the adsorption behavior of serum proteins was investigated. Albumin and γ-globulin hardly adsorbed on the polymer surface as a result of the surface enriched PC group. On the other hand, adsorption of fibrinogen, which is a cell adhesive protein, was maintained at almost the same level as that from the dry surface. As a result the biointerface on the substrate had dual functions, cytocompatibility by a reduction of the general protein adsorption and cell adhesivity based on the adsorption of fibrinogen. The material duality provides for a tunable biointerface and thus an interesting candidate for cell engineering is formed.
  • Keywords
    Surface enrichment , Dynamic molecular motion , poly(lactic acid) , Biointerface , Phosphorylcholine
  • Journal title
    Materials Science and Engineering C
  • Serial Year
    2007
  • Journal title
    Materials Science and Engineering C
  • Record number

    2096432