Creep behavior of nanostructured Mg alloy at ambient and low temperature

Tensile creep test at temperature <0.35 Tm was carried out to investigate the creep behavior in nanostructured Mg alloy with an average grain size of 45 nm consolidated from mechanically alloyed powders using power creep law. The stress exponent is found to be larger than one and with a threshold stress. The activation energy for the creep is measured to be 76 kJ mol−1 smaller than that for grain boundary diffusion in Mg. It is deduced that creep behavior is affected by the presence of impurities and nanovoids inherited from the processing history.