Title of article
P–N Junction creation in 6H-SiC by aluminum implantation
Author/Authors
Ottaviani، نويسنده , , L and Locatelli، نويسنده , , M.L and Planson، نويسنده , , D and Isoird، نويسنده , , K and Chante، نويسنده , , J.P and Morvan، نويسنده , , E and Godignon، نويسنده , , P، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
5
From page
424
To page
428
Abstract
Bipolar diodes, protected with junction termination extensions, were processed in 6H-SiC. A 5-fold aluminum implantation was carried out for the main p+–n junction creation, which led to the material amorphization. The recrystallization variation with the annealing temperature and duration is examined in this paper. We performed the Al implantations with opposite energy orders, in order to study their influence on the diode electrical characteristics. The increasing order led to a better forward conduction, and reverse leakage currents more important.
Keywords
Implantation , Furnace annealing , Recrystallization , Diode characteristics
Journal title
MATERIALS SCIENCE & ENGINEERING: B
Serial Year
1999
Journal title
MATERIALS SCIENCE & ENGINEERING: B
Record number
2134133
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