Title of article
Role of soldering parameters on the electrical performances presented by Cu–Sn–Cu joints used in power diodes
Author/Authors
Martins، نويسنده , , R and Ferreira، نويسنده , , J and Gonçalves، نويسنده , , C and Nunes، نويسنده , , P and Fortunato، نويسنده , , J.I and Marvمo، نويسنده , , A.P. and Martins، نويسنده , , J.I، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2000
Pages
5
From page
275
To page
279
Abstract
Results are presented on the electrical characteristics of power diodes soldered using new lead-free techniques based on Cu–Sn–Cu joints. Special emphasis is put on the role of the thickness of the Cu films electrodeposited on the electrical performances of the power diodes joined and to study the electrical stability of the joints formed, under extreme aggressive conditions.
Keywords
Intermetallic phases , Cu–Sn–Cu system , soldering , Power diodes , electrical parameters , Lead-free solders
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2000
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2136176
Link To Document