Microstructural characterization of pulsed electrodeposited Au/Sn alloy thin films

Based on previous work that identified an electrodeposited composite, multi-layer structure as a viable method of producing eutectic Au/Sn alloys for solder applications, a study of individual phase formation was undertaken. The AuSn phase, because of its higher deposition current (>2.0 mA cm−2), has a much faster deposition rate than Au5Sn, which is deposited at <1.0 mA cm−2. AuSn formation is growth controlled, while Au5Sn formation is nucleation controlled. The AuSn forms a continuous layer within 60 s with a grain size of 50–75 nm. Because of the high deposition current, the dominant formation mechanism is two-dimensional nucleation, resulting in a relatively rough surface finish. Au5Sn, on the other hand, forms a continuous layer within 600 s with an average grain size of 200 nm. Because of the significantly lower deposition current, the dominant formation mechanism is lateral spreading instead of two-dimensional nucleation. The result is a very smooth finish on the deposit surface.