Plastic deformation of nanocrystalline Cu and Cu–0.2 wt.% B

Plastic deformation behavior of nanocrystalline copper with and without trace boron was studied. Fully dense defect-free compacts were produced and mechanical properties were measured. The Hall–Petch (H–P) relationship was followed down to the 25 nm, smallest grain size investigated. The H–P slopes were smaller in nanocrystalline copper than in conventional copper. The role of boron in altering grain growth, strain hardening, recovery, and recrystallization was investigated by comparison of results in nanocrystalline copper with and without trace boron.