Title of article
Influence of intermetallic compounds on the adhesive strength of solder joints
Author/Authors
Lee، نويسنده , , Hwa-Teng and Chen، نويسنده , , Ming-Hung، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2002
Pages
11
From page
24
To page
34
Abstract
This study investigates the influence of intermetallic compound (IMC) growth on the adhesive strength of solder joints. 100Sn and 60Sn40Pb solders were used to solder electrolytic copper wires end to end. Soldered samples were then subjected to high temperature storage testing. The resulting interfacial IMCs in both solders were composed of Cu6Sn5 and Cu3Sn. IMC in the 100Sn solder joint grew faster than in the 60Sn40Pb. The growth behavior of Cu6Sn5 and Cu3Sn were subject to lead concentration. Results of tensile testing revealed an adhesive strength for 60Sn40Pb of 77.3 MPa, higher than the 50.0 MPa for 100Sn. 60Sn40Pb was found more sensitive to high temperature storage than 100Sn.
Keywords
Adhesive strength , 100Sn , Intermetallic compound (IMC) , 60Sn40Pb
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2002
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2140850
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