Packaging barrier films deposited on PET by PECVD using a new high density plasma source

Barrier films for packaging applications are deposited by plasma enhanced chemical vapor deposition (PECVD) on PET film using a new, high density plasma source. The new source, termed the Penning Discharge Plasma source, implements a novel magnetic field/electrode configuration that confines the electron Hall current in an endless loop adjacent to the substrate. By confining the Hall current, a dense, uniform plasma is created and sustained over wide substrates. The result is high rate deposition at low substrate temperatures. The water vapor permeation of SiO2 barrier films is reported as well as deposition rate, coating thickness and other film properties.