• Title of article

    Fractal characterization and simulation of surface profiles of copper electrodes and aluminum sheets

  • Author/Authors

    Han، نويسنده , , J.H. and Ping، نويسنده , , Shan and Shengsun، نويسنده , , Hu، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2005
  • Pages
    8
  • From page
    174
  • To page
    181
  • Abstract
    Surface topography influences electrical contact resistance in resistance spot welding. With structure function analysis, the surface profiles of copper electrodes and aluminum sheets are analyzed and characterized. The result shows that all of the profiles considered are multifractal, the presence of oxide film complicates the multifractal property of aluminum sheet surface and pickling method helps to remove the oxide film. To evade the discrepancy in critical wave numbers, some special measures are taken and the derived critical wave numbers are given. With modified Weierstrass–Mandelbrot (W–M) function and the critical wave numbers, the multifractal profiles are simulated. There are strong similarities between simulated and measured profiles. The probability densities of simulated profiles are compared with the measured ones. The good agreement validates the correctness of methods for characterization and simulation.
  • Keywords
    Copper electrode , Aluminum sheets , Surface Profile , Simulation , characterization , multifractal
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2005
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2148586