Thermal crosstalk in arrays of III-N-based Lasers

This paper presents a 3D comprehensive thermal-electrical self-consistent model of the continuous-wave (CW) operation of one-dimensional arrays of III-N-based laser diodes at room-temperature (RT). Their performance is mostly limited by thermal processes, in particular by thermal crosstalk between array emitters. Based on data collected from a range of secondary sources, the temperature dependence of the thermal and electrical conductivities of III-N materials used to manufacture nitride-based devices is shown to be a function of the thickness, aluminum mole fractions and Si- and Mg-doping levels of the nitride layers. The impact of substrate width and thickness on increasing the efficiency of heat-flux transport and reducing thermal crosstalk is investigated. As expected, the application of a top-mounted diamond heat spreader was found to have considerable influence on the thermal crosstalk between array emitters, enabling the RT CW operation of laser diode arrays with additional emitters.