Title of article
The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films
Author/Authors
Miyamura، نويسنده , , T. and Koike، نويسنده , , J.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
5
From page
620
To page
624
Abstract
Interface adhesion strength of Cu/Cr/polyimide was measured and the effects of annealing atmosphere were investigated. Adhesion strength decreased after annealing in vacuum by 25% and in air by 41%, which was attributed, respectively, to broken carbonyl bonds and to the formation of Cr oxide. Failure mode changed accordingly from cohesive to interfacial at a Cr/polyimide interface.
Keywords
Oxidation , polyimide , Interface , Strength , Degradation , Copper
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2007
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2151170
Link To Document