Interaction of Cu–Al–Ni shape memory alloys particles with molten In and In + Sn matrices

Metal matrix composites for high-damping application were produced by embedding soft metallic matrices (pure In, In–10 wt.% Sn and In + Sn eutectic alloys) in powders of Cu–Al–Ni shape memory alloys (SMAs). During the composite production, the shape memory alloy particles interact with the molten matrices giving place to Cu dissolution from the shape memory alloy particles to the matrices, grain boundary penetration, and formation of intermetallic compounds. Adhesion, wetting and interfacial reaction are crucial for the final composites properties. Preliminary results on microstructural investigations performed applying optical and electron microscopy are presented in this contribution. The influence of thermal treatments on the microstructure of one composite is also discussed.