Title of article
Formation of Ag3Sn plates in SnAgCu solder bumps
Author/Authors
Gong، نويسنده , , Jicheng and Liu، نويسنده , , Changqing and Conway، نويسنده , , Paul P. and Silberschmidt، نويسنده , , Vadim V.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
4
From page
2588
To page
2591
Abstract
Special experiments are designed to obtain the solid reactants directly from a liquid solder during phase transformation. Series of such tests performed throughout reflow, which enables to investigate the entire formation process of intermetallic Ag3Sn plates out of liquid SnAgCu solder bumps. The results show that Ag3Sn plates are formed first in the middle of the cooling stage. In the plane, they have two preferable growth directions. By varying thermal conditions during reflow, the formation mechanism of these plates is discussed.
Keywords
solidification , intermetallics , Crystal growth , Solder
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2010
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2162072
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