Title of article
Temperature dependent slip mode modification in Cu–Al solid solution alloy single crystals
Author/Authors
Su Ha، نويسنده , , Jong and Ig Hong، نويسنده , , Sun، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2013
Pages
4
From page
9
To page
12
Abstract
Slip mode modification of planar slip Cu–Al single crystals with low stacking fault energy was studied at various temperatures. The changes of surface slip appearance and dislocation substructure with temperature was observed and explained in terms of the roles of stacking fault energy and dynamic strain aging.
Keywords
dynamic strain aging , Cu–16 , Stacking fault energy , at.% Al , Dislocation , Planar slip
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2013
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2172498
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