Title of article
Influence of reduction ratio on the interface microstructure and mechanical properties of roll-bonded Al/Cu sheets
Author/Authors
Lee، نويسنده , , K.S. and Lee، نويسنده , , S.E. and Sung، نويسنده , , H.K. and Lee، نويسنده , , D.H. and Kim، نويسنده , , J.S. and Chang، نويسنده , , Y.W. and Lee، نويسنده , , S. and Kwon، نويسنده , , Y.N.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2013
Pages
5
From page
177
To page
181
Abstract
Two-ply Al/Cu sheets were prepared via roll bonding with different reduction ratios. Al/Cu sheets fabricated below 50% of reduction ratio exhibited relatively equiaxed grains without interface reaction, which resulted in weak joint-bonding strength. However, both strong metallurgical bonding at interface and fine, elongated grains from constituent alloys adjacent to the interface were successfully introduced under the reduction ratio of 65%, leading to a strongly enhanced bonding strength of 17.1 N/mm together with an increased elongation up to fracture by 28%.
Keywords
ROLLING , Mechanical properties testing , Al–Cu two-ply sheet , Interface structure , Multilayers
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2013
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2173964
Link To Document