• Title of article

    Hot deformation mechanism and microstructure evolution of a new near β titanium alloy

  • Author/Authors

    Fan، نويسنده , , J.K. and Kou، نويسنده , , H.C. and Lai، نويسنده , , M.J. and Tang، نويسنده , , B. and Chang، نويسنده , , H. and Li، نويسنده , , J.S.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2013
  • Pages
    12
  • From page
    121
  • To page
    132
  • Abstract
    Transmission Electron Microscope (TEM) and Electron Backscattered Diffraction (EBSD) are employed to explore the influence of deformation conditions on microstructure and the deformation mechanism of a new near β titanium alloy Ti-7333 after hot compression tests which at temperatures ranging from 770 to 970 °C and strain rates ranging from 0.001 to 10 s−1. The results showed that the effect of deformation parameters on microstructure evolution is significantly. Both increasing the temperature and decreasing the strain rate seem to promote the dynamic recrystallization process. The mechanism is dominated by dynamic recovery, globularization and dynamic recrystallization. The globularization trend of α phase is more remarkable deformed at higher temperature and lower strain rate. And reverse, the lower temperature and higher strain rate are more favorable to α phase refinement. The fraction of low-angle grain boundaries in the deformation microstructure decreases with the increasing of temperature and decreasing of strain rate. It illustrates the low-angle grain boundaries would turn to high-angle grain boundaries during deformation. The expression of the size of recrystallized grains D r and parameter Z is obtained by regression analysis as ln Dr=8.79964−0.33663ln Z. All the deformed samples present strong 〈001〉 and weak 〈111〉 fiber texture. With the increasing of temperature and decreasing of strain rate, the 〈001〉 texture strengthens gradually and 〈111〉 texture weakens gradually until extinction.
  • Keywords
    Near ? titanium alloy , Hot Deformation , Microstructure evolution , Dynamic recrystallization , Misorientation , EBSD
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2013
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2174024