Annealing behavior of cryogenically-rolled copper

The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50–950 °C) was established. At temperatures below 350 °C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350 °C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.