Title of article
Advanced flip-chip solder bonding
Author/Authors
Humpston، نويسنده , , G. and Needham، نويسنده , , A.P.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1997
Pages
4
From page
375
To page
378
Abstract
Flip-chip solder bonding is becoming the established method for interconnection of high performance semiconductor devices. It is used for the assembly of pixelated detectors, multi-chip modules (MCMs) and monolithic microwave integrated circuits (MMICs). The process has self-aligning features that result in closely dimensioned and highly reproducible array interconnections.
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Serial Year
1997
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Record number
2176270
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