Title of article
Enhancing fatigue cracking resistance of nanocrystalline Cu films on a flexible substrate
Author/Authors
Zhang، نويسنده , , B. and Xiao، نويسنده , , T.Y. and Luo، نويسنده , , X.M. and Zhu، نويسنده , , X.F. and Zhang، نويسنده , , G.P.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2015
Pages
4
From page
61
To page
64
Abstract
We clearly show that fatigue-induced grain growth is suppressed in the annealed nanocrystalline Cu films, which leads to the enhanced resistance to fatigue cracking compared with that of the as-deposited ones. Annealing-stabilization of the nanograin boundaries may provide a potential way to enhance fatigue reliability of nanoscale film-based flexible devices.
Keywords
Fatigue , Thin film , grain growth , Nanocrystalline
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2015
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2178017
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