Title of article
Current trends on design and assembly of pixel detector systems in biomedicine and high-energy physics
Author/Authors
Caria، نويسنده , , M، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2000
Pages
11
From page
167
To page
177
Abstract
The design and assembly of an integrated system made of pixel sensors as sensitive elements combined with read-out electronics and connecting cables or alternative connecting structures, is discussed. The new trends are summarised and critically evaluated. It is shown that many problems are common to High-Energy Physics and Biomedical devices and that this cross-interaction is profitable. Technological choices on new highly integrated modules are presented, with the first successful cases and the risks of failure.
Keywords
Pixel detectors , VLSI read-out , Bump bonding , Multi-chip modules , MCM
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Serial Year
2000
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Record number
2186471
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