Title of article
Experience with mass production bump bonding with outside vendors in the CMS FPIX project
Author/Authors
Merkel، نويسنده , , Petra، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
5
From page
771
To page
775
Abstract
The experience with mass production bump bonding with outside vendors gained in the CMS Forward Pixel project is discussed. Results from two different vendors are presented. After an initial R&D and pre-production phase, 20% of the production parts have been completed. The main results are shown here.
Keywords
CMS , Silicon , pixel , Bump bonding
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Serial Year
2007
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Record number
2208880
Link To Document