• Title of article

    Experimental characterization of shrinkage and desiccation cracking in thin clay layer

  • Author/Authors

    Tang، نويسنده , , Chao-Sheng and Shi، نويسنده , , Bin and Liu، نويسنده , , Chun and Suo، نويسنده , , Wen-Bin and Gao، نويسنده , , Lei، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2011
  • Pages
    9
  • From page
    69
  • To page
    77
  • Abstract
    Knowledge of shrinkage mechanism and the accompanied cracking behavior is helpful for better understanding the hydraulic and mechanical performance of clay soil under atmosphere condition. Initially saturated thin clay layers were prepared and subjected to air drying in this investigation. Water evaporation, volume shrinkage, surface crack initiation and propagation processes were monitored during the whole drying period. With application of image processing technique, the geometric or morphological characteristics of crack patterns were quantitatively described. Results show that the water in the clay layer evaporated at a near constant rate and then it began to decline when the water content was close to the air entry value. The clay layer volume shrinkage was contributed completely by vertical subsidence before desiccation crack initiation, and the measured final vertical shrinkage strain was several times higher than the lateral shrinkage strain. In addition, it was found that most of the cracks and volume shrinkage occurred during the constant rate of evaporation period while the specimen was still saturated. Crack initiation and propagation generally took place in three stages and terminated at the shrinkage limit. During the process of crack propagation, the crack intersections reached a stable value first and were followed by crack length and crack width.
  • Keywords
    Clay layer , Evaporation , Crack pattern , Desiccation crack , Shrinkage
  • Journal title
    Applied Clay Science:an International Journal on the Application...
  • Serial Year
    2011
  • Journal title
    Applied Clay Science:an International Journal on the Application...
  • Record number

    2223273