In situ TEM investigation of microstructural behavior of superplastic Al–Mg–Sc alloy

Dynamic changes in microstructure of the superplastic ultrafine-grained Al–3Mg–0.2Sc (wt.%) alloy refined by equal-channel angular pressing (ECAP). were observed by in situ transmission electron microscopy at temperatures up to 300 °C (annealing and tensile deformation) in order to simulate the initial stages of superplastic testing. It was found that the microstructure changes significantly during the preheating before the superplastic deformation, which was accompanied by decreased microhardness. During the deformation at 300 °C, high dislocation activity as well as motion of low-angle grain boundaries was observed while high-angle grain boundaries did not move due to the presence of scandium in the alloy.