Microstructure and texture evolution of Cu–Nb composite wires

The evolution of microstructure and texture in Cu–Nb composite wires fabricated by an accumulative drawing and bundling process was investigated by backscattered electron (BSE), electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM). Results indicate the onset of severe curling and shape changing occurred at the size of Nb ~ 400 nm with a surface increase of about 6.91 μm2/μm3 (the area per unit volume). Two kinds of grain boundaries in Nb are suggested: one is 20°–50° boundary with a rotate/tilt axis around <110> parallel to drawing direction (DD), and another is > 50° boundary with the axis perpendicular to DD. The curling phenomenon occurred at the Cu–Nb interface and is related not only to the deformation mechanism of Nb but also to the presence of interface. This result is distinct from reported works showing that curling takes place when BCC metals are heavily drawn (Area reduction > 73%). The variation in microstructure and texture evolution between Cu and Nb filaments was discussed based on the differences in deformation mechanisms of these two metals.