Kinematic simulation of high-performance grinding for analysis of chip parameters of single grains

In this paper, a comprehensive view on a kinematic simulation of the grinding process (KSIM) is given. Using detailed modeling of the grinding wheel topography, KSIM is able to compute and evaluate chip parameters of each grain participating in the material removal process. This provides the opportunity to investigate the grinding process in a level of detail impossible to achieve in experiments. Using KSIM, the influence of process parameters and changes in the grinding wheel topography on the chip parameters and hence on the material removal process can be investigated and used for optimization of the process, the tool and for evaluation of process–machine interactions. The paper summarizes the research activities involving KSIM conducted in the last 12 years and presents new insights in the modeling process and the examination of process–machine interactions using this simulation tool.