An experimental technique to determine critical stress intensity factors for delamination initiation

Interfacial delamination is an important reliability concern in multilayered microelectronic packages. Local asymptotic solutions, based on linear elastic assumptions, are available for estimating the free-edge stress intensity factor (SIF). However, to be able to predict delamination initiation, it is necessary to determine the critical free-edge SIF. s paper, an experimental method has been proposed and conducted to determine the critical free-edge SIF. The test is based on the simple and standard shear strength test, which is well specified by ASTM standard for surface mount components, as opposed to specially designed or complicated test apparatus and fixture. The critical free-edge SIF for copper/ViaLuxTM 81 photo-definable dry film PDDF interface has been determined with the proposed test method and calibrated using finite element analysis.