Experimental and numerical investigation on the reliability of leadfree solders

To assess the lifetime of leadfree solder joints, it is necessary to investigate their creep and failure behavior under cyclic thermo-mechanical loading. In connection with finite element analyses the use of an appropriate material model is necessary. The following paper reports on the implementation of a specific version of the viscoplastic constitutive model of Chaboche in the FEM-code ABAQUS, the experimental program for the identification of the material parameters of a Sn–Ag–Cu solder and a comparison of some numerical and experimental results.