Interaction integrals for thermal fracture of functionally graded piezoelectric materials

This paper presents domain form of the interaction integrals based on three independent formulations for computation of the stress intensity factors and electric displacement intensity factor for cracks in functionally graded piezoelectric materials subjected to steady-state thermal loading. Each of the formulation differs in the way auxiliary fields are imposed in the evaluation of interaction integral and each of them results in a consistent form of the interaction integral in the sense that extra terms naturally appear in their derivation to compensate for the difference in the chosen crack tip asymptotic fields of homogeneous and functionally graded piezoelectric medium.