Ar+ ion milling of InSb for manufacturing single electron devices

Ar+ ion milling of InSb for manufacturing single electron devices was studied. It is shown that pyramidal structures (porous) are created on the (1 1 1) surface of InSb wafers by anisotropic etching. Also it was shown the axis of the pyramidal structure is a function of the angle of the Ar+ incident beam and does not depend on the energy of the beam. EDX measurement results show InxOy and SbxOy were not created on the surface after milling process. FTIR measurement results show that the surface reflection was decreased and less than 0.3 V flat band voltage was seen in capacitance voltage measurement results. SEM images show that the etching has approximately vertical profile. Therefore the Ar+ milling technique can be used as a dry etching technique for manufacturing mesa and/or porous structures of InSb. Since the surface is porous and of near-pyramidal morphology, one can simulate the surface by a set of needles each of which is a nanometer-size capacitance (i.e. single electron device). We showed, the threshold voltage of this single electron device is 0.3 V approximately, and therefore it can be used for studying single-electron or Coulomb blockade effects.