Effect of Boron Nitride Nano Filler Filled Epoxy Composites for Underfill Application

The research aims to fabricate and characterise epoxy nano composites for underfill applications. Deglycidyl ether of bisphenol-A (DGEBA) and epoxide novolac resin were used in this study and they are referred as EPON 8281 and DEN 431, respectively. Flow ability, thermal conductivity and flexural properties of boron nitride (BN) filled EPON 8281 and DEN 431 epoxy composites were investigated. BN fillers in epoxies were varied from 1 to 4 vol%. The results showed that EPON 8281 had a good flow ability with higher flow rates than DEN 431. The thermal conductivity of the composites increased with the addition of filler. Higher thermal conductivity value was observed in DEN 431. At maximum loading of BN filler (4 vol%), the thermal conductivity of DEN 431 is 3.2% higher than EPON 8281. Generally, EPON 8281 showed higher flexural strength but lower flexural modulus compared to DEN 431.