Title of article
High Density Interconnect Embedded Magnetics for Integrated Power
Author/Authors
W. A. Roshen، نويسنده , , C. S. Korman، نويسنده , , and W. Daum، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
13
From page
867
To page
879
Keywords
multichip modules(MCM). , High density interconnect (HDI)
Journal title
IEEE TRANSACTIONS ON POWER ELECTRONICS
Serial Year
2006
Journal title
IEEE TRANSACTIONS ON POWER ELECTRONICS
Record number
340864
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