Title of article
Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging
Author/Authors
M. Ivanova، نويسنده , , Y. Avenas، نويسنده , , and C. Schaeffer، نويسنده , , J.-B. Dezord، نويسنده , , and J. Schulz-Harder، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
7
From page
1541
To page
1547
Keywords
Space application , Electronic cooling , heat pipe , Direct bonded copper (DBC) , thermal experiments.
Journal title
IEEE TRANSACTIONS ON POWER ELECTRONICS
Serial Year
2006
Journal title
IEEE TRANSACTIONS ON POWER ELECTRONICS
Record number
340941
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