Title of article
Properties of Direct Aluminium Bonded Substrates for Power Semiconductor Components
Author/Authors
A. Lindemann and G. Strauch، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
8
From page
384
To page
391
Keywords
powersemiconductor devices , direct copper bonded (DCB) substrates , Ceramic insulators , direct aluminum bonded(DAB) substrates , Reliability.
Journal title
IEEE TRANSACTIONS ON POWER ELECTRONICS
Serial Year
2007
Journal title
IEEE TRANSACTIONS ON POWER ELECTRONICS
Record number
341018
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