Title of article
Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages
Author/Authors
Sung Yi، نويسنده , , Kam Yim Sze، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1998
Pages
15
From page
65
To page
79
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year
1998
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number
351135
Link To Document