Title of article
Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method
Author/Authors
D. S. Liu، نويسنده , , Y. C. Chao، نويسنده , , C. H. Wang، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
24
From page
263
To page
286
Keywords
Wirebond , Gold wire , Heat a5ected zone , Loop pro le
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year
2003
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number
351433
Link To Document