Title of article
A hybrid 3D thermo-elastic infinite element modeling for area-array package solder joints
Author/Authors
D. S. Liu، نويسنده , , D. Y. Chiou، نويسنده , , C. H. Lin، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
25
From page
1703
To page
1727
Keywords
In nite element , In nite element method , Solder joints , MCM BGA assembly , IE–FE coupling method
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year
2003
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number
351508
Link To Document