Title of article
Creep flow, diffusion, and electromigration in small scale interconnects
Author/Authors
Dongchoul Kim ، نويسنده , , Wei Lu، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
15
From page
2554
To page
2568
Keywords
Creep , Nanostructure , Phase field model , Electromigration
Journal title
Journal of the Mechanics and Physics of Solids
Serial Year
2006
Journal title
Journal of the Mechanics and Physics of Solids
Record number
354987
Link To Document