Effect of Heat Transfer on the Performance of Thermoelectric Heat Pumps

The performance analysis of thermoelectric (semiconductor) heat pumps is performed using the combined method of finite time thermodynamics and non-equilibrium thermodynamics. The heating load and coefficient of performance (COP) expressions for the heat pump, which is composed of multi-elements, are derived with considerations of heat transfer irreversibility in the heat exchangers between the heat pump and the external heat reservoirs as well as the other internal irreversibilities. Numerical examples are provided. The effects of heat transfer, the number of elements and the other design parameters on the performance of the heat pump are analyzed.