• Title of article

    Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect

  • Author/Authors

    H. LU، نويسنده , , H. G. SHI، نويسنده , , M. ZHOU، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2007
  • Pages
    8
  • From page
    87
  • To page
    94
  • Keywords
    digital speckle correlation , Microelectronics , Reliability , solder joints.
  • Journal title
    Fatigue and Fracture of Engineering Materials and Structures
  • Serial Year
    2007
  • Journal title
    Fatigue and Fracture of Engineering Materials and Structures
  • Record number

    360011

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=360011