Title of article
Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model
Author/Authors
Shi Xunqing، نويسنده , , Wang Zhiping، نويسنده , , John HL Pang، نويسنده , , Zhang Xueren ، نويسنده , , Nie Jingxu ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2002
Pages
14
From page
274
To page
287
Keywords
dislocation controlled creep flow , Creep-fatigue interaction , constitutiverelation , life prediction model , solder joint reliability
Journal title
Acta Mechanica Sinica
Serial Year
2002
Journal title
Acta Mechanica Sinica
Record number
360320
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